发明名称 |
Thin multi-chip flex module |
摘要 |
A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
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申请公布号 |
US2011139329(A1) |
申请公布日期 |
2011.06.16 |
申请号 |
US20110931015 |
申请日期 |
2011.01.21 |
申请人 |
CLAYTON JAMES E;FETHI ZEKERYAE |
发明人 |
CLAYTON JAMES E.;FETHI ZEKERYAE |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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