| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for electronic components which can be produced at low cost, an electronic component device, and a method of manufacturing the package for the electronic components. <P>SOLUTION: The package for electronic components includes a container, having a hollow space part which is opened by an aperture; a lead frame arranged internally and externally passing through the wall part of the container; and a lid part having an electromagnetic shield structure which covers the aperture of the container, and in the hollow space electronic components being arranged. The package for electronic components, further, includes a groove part formed along the inner wall of the hallow space side of the wall part between the predetermined voltage line among the lead frames and the apertures, and a conductive part connecting the lid part and the predetermined voltage line in the groove part. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
