LIGHT EMITTING DIODE PACKAGE, LIGHT EMITTING DIODE PACKAGE MODULE INCLUDING THE PACKAGE, METHOD OF MANUFACTURING THE SAME, HEAD LAMP MODULE INCLUDING THE MODULE, AND METHOD OF CONTROLLING THE HEAD LAMP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a light emitting diode package, a light emitting diode package module including the package, a method for manufacturing the module, a head lamp module including the module, and a method for controlling the head lamp module.

SOLUTION: The light emitting diode package 120 includes: a package substrate 121; a light emitting diode chip 130 mounted on one surface of the package substrate 121; an electrode pad 126 formed on the other surface of the package substrate 121 and electrically connected to the light emitting diode chip 130; and a heat radiation pad 125 formed on the other surface of the package substrate 121 and electrically insulated from the electrode pad 126.

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