APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing an electronic component and a method for manufacturing the electronic component that form the electronic component to be sucked and fixed to a porous member by injection molding. SOLUTION: The apparatus for manufacturing the electronic component includes: upper and lower metal molds, at least one of which being formed as the porous member on which the electronic component is mounted, including an internal space for accommodating the electronic component therein; a release film providing unit providing a release film to the internal space of the upper and lower metal molds; and a molding resin providing unit providing a molding resin to the internal space to allow the electronic component to be injection-molded. COPYRIGHT: (C)2011,JPO&INPIT