| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, wherein, in a board for multiple patterning of a printed wiring board, an alignment mark prepared on each printed wiring board is recognized by using a recognition camera to adjust a processing position in units of printed wiring boards. <P>SOLUTION: When alignment marks 159 of two printed wiring boards 10 arranged adjacent to each other are simultaneously imaged by using the recognition camera to recognize the two alignment marks respectively, a position of the recognition camera is adjusted such that each of the alignment marks is positioned equidistant from the center of an imaging region of the recognition camera. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
