| 摘要 |
PURPOSE: A wafer cleaning device by a spin scrubber and cleaning method using the same are provided to have a double-side cleaning chamber which simultaneously cleans front and back sides, thereby reducing cleaning time. CONSTITUTION: A clamping member(610) contacts an edge of a wafer(20) to vertically support the wafer. A frontal nozzle unit includes a first nozzle(621) and a first transfer shaft(622). Cleaning liquid is sprayed onto the frontal side of the wafer supported by the clamping member. The first transfer shaft supports the first nozzle. A back nozzle unit(630) includes a second nozzle(631) and a second transfer shaft(632). Cleaning liquid is sprayed onto the back side of the wafer supported by the clamping member. The second transfer shaft supports the second nozzle.
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