| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition which simultaneously satisfies sufficiently low viscosity at molding temperature and higher filling of a filler for inhibiting warpage; and to provide a semiconductor package with high reliability prepared by using the composition. SOLUTION: The liquid sealing resin composition which is based essentially on (A) an epoxy resin, (B) a hardening agent for an epoxy resin, (C) an inorganic filler, and (D) a hardening accelerator, in which 80 wt.% or more and 95 wt.% or less of (C) the inorganic filler is contained in the liquid sealing resin composition, characterized in that the viscosity measured at the molding temperature is 1 Pas or more and 50 Pas or less. COPYRIGHT: (C)2011,JPO&INPIT
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