| 摘要 |
An electronic device (201) and a module (202) for an electronic device (201) are disclosed, together with method of manufacturing the same. Each module (202) comprises a substrate (203) having an upper surface (208) to which an integrated circuit die (204) is mounted. In preferred embodiments, a solder ball (214) is mounted to the upper surface (208) of the substrate (203) in such a manner that, on melting, a flow of molten solder extends from the solder ball (214) over the edge of the substrate (203). In this manner, an electrical connection between adjacent modules (202) can be formed the connection of molten solder flowing from a solder ball (214) on each of the modules (202). |
