| 摘要 |
<p>The device has a base body with a sequence of stacked ceramic layers, several inner electrodes (10A,10B,15A,15B), each arranged between two ceramic layers, contact surfaces (2,3) on the surface of the base body that are conductively connected to the inner electrodes, whereby inner electrodes connected to the same contact surface form an electrode stack (10,15) and at least one interconnecting structure (5A) connecting two electrode stacks. The component is symmetrical to first (200) and second planes parallel and perpendicular to a ceramic layer in respect of the interconnecting structure(s) and the inner electrodes.</p> |
