发明名称 Packaging structure of SIP and a manufacturing method thereof
摘要 A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.
申请公布号 US7960847(B2) 申请公布日期 2011.06.14
申请号 US20100778456 申请日期 2010.05.12
申请人 AZUREWAVE TECHNOLOGIES, INC. 发明人 HUANG CHUNG-ER;KUO MING-TAI
分类号 H01L23/28;H01L23/29;H01L23/31 主分类号 H01L23/28
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