发明名称 |
Packaging structure of SIP and a manufacturing method thereof |
摘要 |
A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module. |
申请公布号 |
US7960847(B2) |
申请公布日期 |
2011.06.14 |
申请号 |
US20100778456 |
申请日期 |
2010.05.12 |
申请人 |
AZUREWAVE TECHNOLOGIES, INC. |
发明人 |
HUANG CHUNG-ER;KUO MING-TAI |
分类号 |
H01L23/28;H01L23/29;H01L23/31 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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