| 摘要 |
In some embodiments, a temporary package for at-speed functional test of semiconductor chip, including high power chips, is presented. In this regard, a method is introduced including placing an integrated circuit die on a contactor layer, the contactor layer to electrically couple contacts on the integrated circuit die with contacts on a multi-layer substrate designed to be permanently attached with the integrated circuit die, placing an integrated heat spreader over the integrated circuit die, and bonding the integrated heat spreader with the substrate, the integrated heat spreader holding the integrated circuit die in place to form a temporary package. Other embodiments are also disclosed and claimed.
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