| 摘要 |
PURPOSE: A SIM card manufacturing method is provided to reduce production cost. CONSTITUTION: An SIM(Subscriber Identity Module) card sheet is manufactured through thermal compression after a plurality of resin films(11a~11d) and heat bonding films(12a,12b) are laminated. A load hole(13) for mounting one or more COBs(Chip On Boards) is previously processed on the top resin film of the resin films. The COB is mounted to the load hole of the SIM card sheet. A portion around the COB is cut out in an SIM card shape. A separate SIM card is manufactured. |
