| 摘要 |
PURPOSE: A sputtering device is provided to prevent plasma ions from being piled up on a substrate carrier by installing a prevention plate in a floating shield. CONSTITUTION: A sputtering device comprises a vacuum chamber, a backing plate, multiple targets, a susceptor, a substrate carrier(170), a floating shield(160), and one or more prevention plates(162,164). The backing plate is formed in the vacuum chamber and receives voltage. The targets are arranged on the front surface of the backing plate. The susceptor is formed inside the vacuum chamber under the backing plate. a substrate(102) is arranged on the front surface of the susceptor. The substrate carrier fixes the substrate. The floating shield is arranged on the edge of the substrate and blocks plasma ions attached on the substrate carrier. The prevention plates are formed in the floating shield and prevent the plasma ions from flowing into a space between the floating shield and the substrate. |
