| 摘要 |
<p>PURPOSE: A device for separating and conveying a wafer is provided to immediately separate or convey a wafer after a conveyer without a separate moving process, thereby maximizing productivity. CONSTITUTION: A pickup conveyor(1) is vertically installed on the frontal side of a supply unit. A suction hole(11) suctions a wafer. The suction hole is formed on the surface of a belt(10) of the pickup conveyor. The conveyor includes a support plate(30) on which another suction hole(31) is formed. A transfer conveyor(2) is tilted between the pickup conveyer and the inlet for following processes. The transfer conveyor attaches a wafer which is elevated on the pickup conveyor to the surface of a belt(20) and transfers the belt to the following processes.</p> |
