| 摘要 |
A printed circuit board manufacturing method includes: a hole-forming step of forming a through hole in a substrate that will become an element of a printed circuit board after manufacturing; and a jig insertion step of inserting a jig in the through hole formed in the hole-forming step such that the jig adheres to a portion of an inner wall of the through hole, the inner wall having a portion connecting to the outside of the through hole. The method further includes a conductive-film forming step of forming a conductive film only on the portion of the inner wall of the through hole connecting to the outside of the through hole, after the jig is inserted into the through hole in the jig insertion step.
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