MEMS MICROPHONE PACKAGE USING ADDITIONAL CHAMBER

摘要

PURPOSE: A MEMS microphone package using an additional chamber is provided to increase back chamber space of the MEMS chip itself, by attaching a MEMS microphone chip onto the additional chamber. CONSTITUTION: A MEMS microphone package comprises a MEMS microphone chip(10), a PCB substrate(102) and a case. The PCB substrate has an additional chamber(104) using a PSR(Photo Solder Resist) dam. The additional chamber is formed at the position to mount the MEMS microphone chip. The case is combined to the PCB substrate, and forms a space to accommodate components.