发明名称 |
LAMINATE ELECTRONIC DEVICE |
摘要 |
A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.
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申请公布号 |
US2011127675(A1) |
申请公布日期 |
2011.06.02 |
申请号 |
US20090628428 |
申请日期 |
2009.12.01 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
EWE HENRIK;MAHLER JOACHIM;PRUECKL ANTON;LANDAU STEFAN |
分类号 |
H01L23/538;H01L21/50;H01L21/56 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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