| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus and method, capable of preventing the adhesion of sputter particles scattered from a target to other targets. SOLUTION: The sputtering apparatus includes a plasma chamber for generating plasma, and a container with a film deposition chamber which communicates with the plasma chamber, wherein at least two or more targets provided in the container are sputtered with plasma, and sputter particles scattered from the sputtered targets are accumulated on the surface of a substrate provided within the film deposition chamber. The sputtering apparatus has a suppressive measures for suppressing, when sputtering one of the at least two or more targets with plasma, the adhesion of the sputter particles scattered from the sputtered target onto other targets. The sputtering method uses the sputtering apparatus. COPYRIGHT: (C)2011,JPO&INPIT
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