发明名称 |
Wässriges saures Bad und Verfahren zum elektrolytischen Abschneiden von Kupfer |
摘要 |
Aqueous acid bath comprises at least a copper-ion source, at least an acid-ion source, at least a brightening compound and at least a leveling-compound comprising unfunctionalized peptides, or synthetically produced and functionalized-amino acids and -peptides. An independent claim is included for a process for electrolytic deposition of copper on a workpiece, comprising providing the aqueous acid bath for electrolytic deposition of copper and at least an anode, contacting the workpiece and the anode, with the aqueous acid bath, and generating an electrical current flow between the workpiece and the anode, where the copper is deposited on the workpiece. |
申请公布号 |
DE502008003271(D1) |
申请公布日期 |
2011.06.01 |
申请号 |
DE20085003271T |
申请日期 |
2008.04.28 |
申请人 |
AUTOTECH DEUTSCHLAND GMBH |
发明人 |
BRUNNER, HEIKO DR.;ROELFS, BERND;ROHDE, DIRK;PLIET, THOMAS |
分类号 |
C25D3/38;C25D5/18;H05K3/24;H05K3/42 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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