Electronic parts mounting substrate and process for manufacturing the same

摘要

An electronic parts mounting substrate having an insulating substrate in which a mount opening portion for mounting electronic parts thereat is formed, and side-surface patterns having a plurality of potentials and provided on the wall surfaces of the mount opening portion. The side-surface patterns are formed by etching side-surface pattern non-formation portions of a conductive layer formed on the entirety of the wall surfaces of the mount opening portion in a state where the side-surface pattern formation portions are coated with a side-surface pattern resist film. The respective side-surface patterns are insulated from each other by exposed surfaces provided between the patterns where portions of the insulating substrate are exposed by said etching.