发明名称 COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME
摘要 <p>PURPOSE: A composition for forming a substrate is provided to ensure excellent thermal, electrical, and mechanical characteristics when used as a high-speed circuit and an insulating material of a printed circuit board of a high frequency band. CONSTITUTION: A composition for forming a substrate comprises: a liquid crystal thermosetting oligomer having at least one soluble structure unit and at least one thermosetting group of the terminal of the main chain; and a compound formed by polymerizing a fluorine compound having a functional group capable of reacting with the main chain of the liquid crystal thermosetting oligomer.</p>
申请公布号 KR20110058543(A) 申请公布日期 2011.06.01
申请号 KR20090115370 申请日期 2009.11.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YUN, GEUM HEE;OH, JUN ROK;LEE, KEUN YONG
分类号 C08L79/08;C08J5/24;C08L77/06;H05K3/46 主分类号 C08L79/08
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