发明名称 |
Scribe line layout design |
摘要 |
A scribe line layout design to reduce the damage caused by sawing the wafer is presented. An embodiment comprises metal plates located within the scribe lines and at least partially within the junctions of the scribe lines. Each of these metal plates has one or more slots to help relieve the pressure. Alternatively, instead of metal plates, grooves that may be filled with metal could be placed into the scribe lines. These metal plates could also be used concurrently with a seal ring for better protection during sawing.
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申请公布号 |
US7952167(B2) |
申请公布日期 |
2011.05.31 |
申请号 |
US20070796202 |
申请日期 |
2007.04.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LEE HSIN-HUI;LII MIRNG-JI;JENG SHIN-PUU;HOU SHANG-YUN |
分类号 |
H01L29/06 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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