| 摘要 |
PURPOSE: A stack package is provided to prevent production costs for forming an insulating layer by preventing a short circuit between the connecting member and an upper package without forming an insulating layer on the bottom of an upper package. CONSTITUTION: In a stack package, an upper package(300) comprises a first semiconductor chip(310) and a first penetrating electrode(320). The first semiconductor chip comprises a first bonding pad(311) and a first protective film(312) on the top. The first penetrating electrode is electrically connected to the first bonding pad(311). A lower package(400) comprises a second semiconductor chip(410) and a second penetrating electrode(420). A second bonding pad(411) and a second protective film are formed in the top side of the second semiconductor chip.
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