| 摘要 |
<P>PROBLEM TO BE SOLVED: To overcome the problem in a light emitting module having a light emitting device, wherein it is difficult to secure long term reliability while ensuring heat dissipation. <P>SOLUTION: In the light emitting module 10, a mounting substrate 14 is formed of alumina, AIN or Si and a semiconductor light emitting device 12 is mounted on the substrate. A heat dissipating substrate 16 supports the mounting substrate 14. The heat dissipating substrate 16 is formed of a composite material consisting of Cu and a metal whose coefficient of thermal expansion is lower than Cu. The mounting substrate 14 is bonded to the heat dissipating substrate 16 by solder 18 being a metal bonding material whose melting point is 450°C or below. The heat dissipating substrate 16 is formed of a cladding material where Cu and Mo are laminated or a composite material where Mo is impregnated with Cu. <P>COPYRIGHT: (C)2011,JPO&INPIT |
