PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the quality of a product by forming an insulation layer on the surface of a metal base by an oxidization film through an anodizing process. CONSTITUTION: An oxidation film(21) is formed on an insulation layer(20) by anodizing a metal base(10). A plurality of pores(23) are formed on the oxidation film. An electrolyte has a thermal diffusion material for anodizing. A thermal diffusion unit(40) is formed by depositing the thermal diffusion material in the pore in an anodizing process. A conductive pattern unit(30) is formed on one side of the insulation layer.