发明名称 |
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-SEALED SEMICONDUCTOR DEVICE |
摘要 |
The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 µm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance. |
申请公布号 |
EP3064521(A1) |
申请公布日期 |
2016.09.07 |
申请号 |
EP20140878027 |
申请日期 |
2014.11.28 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD |
发明人 |
SUMITA KAZUAKI;UEHARA TATSUYA;KUSHIHARA NAOYUKI |
分类号 |
C08G59/42;C08K9/06;C08L63/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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