发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having a processing means that not only can reliably carry out processing for cleaning and polishing including a slope portion of a peripheral edge of a substrate, but also includes an incomplicate support means therefor and is excellent in its durability. SOLUTION: The substrate processing apparatus includes: a substrate support means of supporting the substrate; the processing means that includes sponge including, as a processing part, a plane having a predetermined diameter, formed atop, and having a recess in the center; the support means for the processing means that supports the processing means at a predetermined position in a state where the processing part is directed to a peripheral edge of the substrate so that the axis of the processing means is perpendicular to the axis of the substrate supported by the substrate support means; and a rotating means for the processing means that is attached to the support means for the processing means. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011103394(A) 申请公布日期 2011.05.26
申请号 JP20090258150 申请日期 2009.11.11
申请人 SEIWA KOGYO KK 发明人 TAGAMI MASAO
分类号 H01L21/304;B08B1/04;B24B9/00 主分类号 H01L21/304
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