THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELATING THERETO
摘要
The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
申请公布号
WO2011063204(A1)
申请公布日期
2011.05.26
申请号
WO2010US57379
申请日期
2010.11.19
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;AUMAN, BRIAN, C.;DUNBAR, MEREDITH, L.;HE, TAO;KOURTAKIS, KOSTANTINOS