PREPREG, LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING

摘要

Disclosed is a prepreg obtained by impregnating a woven-fabric base with a thermosetting resin composition, wherein the thermosetting resin composition comprises 100 parts by volume of a thermosetting resin and 80-200 parts by volume of an inorganic filler. The inorganic filler comprises gibbsite-form aluminum hydroxide particles (A) having an average particle diameter (D50) of 2-15 µm, at least one inorganic ingredient (B) selected from a group consisting of boehmite particles having an average particle diameter (D50) of 2-15 µm and inorganic particles that have an average particle diameter (D50) of 2-15 µm and that contain crystal water having a release initiation temperature of 400ºC or higher or contain no crystal water, and aluminum oxide particles (C) having an average particle diameter (D50) of 1.5 µm or smaller, the ratio of the gibbsite-form aluminum hydroxide particles (A), the at least one inorganic ingredient (B) selected from a group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:(0.1-2.5):(0.1-1) (by volume).