| 摘要 |
PURPOSE: A method for manufacturing a light emitting diode(LED) is provided to minimize the refraction and the scattering of light by forming a molding part horizontally and maintaining the surface condition of the molding part. CONSTITUTION: LED devices and pads are arranged on a wafer and compartment units are formed on the area of pads to be projected in a constant height(S10). A fluorescent material is applied to cover the LED devices(S20). After the fluorescence material is dried, the surface of the covered LED devices are processed and removed until the department units are exposed(S30). Each pad is divided into the unit LED chip by cutting the middle part of the pads(S40). The divided unit LED chip is respectively mounted on a die(S50). |
