MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS

摘要

PURPOSE: A microelectromechanical system microphone packaging system is provided to improve the reliability by offering a packaging which forms a sealed cavity. CONSTITUTION: A conductive frame comprises a lead frame or a micro lead frame package. The conductive frame comprises one or more gaps. The gaps are extended to a bottom surface of the conductive fame from the surface of the conductive frame. A cavity(110) is partly expanded to the inside of the conductive frame. A silicon die(112) is connected to the conductive frame. A insulator(126) is expanded to the bottom of the conductive frame through the gap in the conductive frame.