DEVICES PACKAGES AND METHODS OF FABRICATING THE SAME

摘要

PURPOSE: A device package and a manufacturing method thereof are provided to manufacture a small device package with low costs by sealing a MEMS(Micro Electro Mechanical System) or sensor device structure with a micro metal cover. CONSTITUTION: A device structure is positioned on the active surface of a substrate. An input pad(111i) and an output pad(111o) are located on the active surface of the substrate. A metal cover(214) has an internal space to seal the device structure on the active surface of the substrate. A junction pattern is interposed between the active surface of the substrate and the metal cover. The junction pattern includes nonconductive adhesive materials. Input and output pads are interposed between the active surface of the substrate and the junction pattern.