INLAYER OF SMARTCARD, SMARTCARD COMPRISING THE INLAYER AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An inlayer of a smartcard which is free from thermal deformation, a smartcard comprising the inlayer and a manufacturing method thereof are provided to efficiently perform chip packaging without an adhesive and heat. CONSTITUTION: A first screw line is processed in an inlay substrate(31), and a second screw line is processed in a chip package(38). Through the rotary fastening between the first and second screw lines, the chip package is coupled to the inlay substrate. An IC(Integrated Chip) is mounted at the chip package, and an antenna coil(33) is electrically connected to the chip package.