发明名称 |
Manufacturing method of multilayer substrate |
摘要 |
<p>Single-sided conductor patterned films 21 are prepared, each of which has a conductor pattern 22 formed only one side of a resin film 23 and via hole 24 filled with conductive paste 50. A single-sided conductor patterned film 31 which has a conductor pattern 22 formed only one side of a resin film 23 and an opening formed in the resin film 23 so as to expose an electrode 32 is laminated on the single-sided conductor patterned films 21. Moreover, a cover layer with an opening to expose an electrode 37 is laminated on a bottom surface of the single-sided conductor patterned films 21 to form a laminate. Then, by pressing the laminate while heating, a multilayer substrate 100 having the electrodes at both sides thereof can be produced. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE></p> |
申请公布号 |
EP1215948(B1) |
申请公布日期 |
2011.05.25 |
申请号 |
EP20010129757 |
申请日期 |
2001.12.13 |
申请人 |
DENSO CORPORATION |
发明人 |
KONDO, KOJI;KAMIYA, TETSUAKI;HARADA, TOSHIKAZU;ONODA, RYUICHI;KAMIYA, YASUTAKA;MASUDA, GENTARO;YAZAKI, YOSHITARO;YOKOCHI, TOMOHIRO |
分类号 |
H05K3/28;H05K3/46;H05K1/11;H05K3/00;H05K3/40 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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