PRINTED CIRCUIT BOARD FOR SEMI-CONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board for a semiconductor package and a manufacturing method thereof are provided to lower the entire thermal expansion coefficient of a printed circuit board for a semiconductor package. CONSTITUTION: A buildup layer(110) forms a circuit pattern(115) including a via(113). A buffer layer(120) is placed on one side of the buildup layer and buries a metal bump(125) connected to the via. A semiconductor chip(130) is mounted on one side of the buffer layer and is connected to the metal bump.