发明名称 |
Airflow/cooling solution for chassis |
摘要 |
<p>A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
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申请公布号 |
EP2146563(A3) |
申请公布日期 |
2011.05.25 |
申请号 |
EP20080253245 |
申请日期 |
2008.10.06 |
申请人 |
JUNIPER NETWORKS, INC. |
发明人 |
DEMICK, BOYDEN;PRADEEP, SINDHU;HOCKER, KEITH J. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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