发明名称 Method of forming semiconductor device
摘要 A semiconductor device may include, but is not limited to, first and second well regions, and a well isolation region isolating the first and second well regions. The first and second well regions each may include an active region, a device isolation groove that defines the active region, and a device isolation insulating film that fills the device isolation groove. The first and second well regions may include first and second well layers, respectively. The well isolation region may include a well isolation groove, a well isolation insulating film that fills the well isolation groove, and a diffusion stopper layer disposed under a bottom of the well isolation groove. The first and second well layers have first and second bottoms respectively, which are deeper in depth than a bottom of the device isolation groove and shallower in depth than the bottom of the well isolation groove.
申请公布号 US7947550(B2) 申请公布日期 2011.05.24
申请号 US20100873802 申请日期 2010.09.01
申请人 ELPIDA MEMORY, INC. 发明人 FUJIMOTO HIROYUKI;TAKAISHI YOSHIHIRO
分类号 H01L21/8238 主分类号 H01L21/8238
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