发明名称 |
Socket assembly with heat sink module |
摘要 |
A socket assembly has a socket and a heat sink module detachably mounted on the socket. The socket has a base, a sliding board mounted on the base, a lid disposed upon the base and an actuator disposed between the base and the cover. The heat sink module has a fastening frame surrounding the base, a cover pivotally assembled to an end of the fastening frame and a heat sink mounted on the cover. The cover has a latching portion which latches with a top wall of the lid when the cover rotates to a closed position. The heat sink is brought by the cover to pass an open defined on the lid and to abut against an IC package seating on the sliding board.
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申请公布号 |
US7946881(B2) |
申请公布日期 |
2011.05.24 |
申请号 |
US20090609021 |
申请日期 |
2009.10.30 |
申请人 |
HON HAI PRECISION IND. CO., LTD. |
发明人 |
HSIEH WEN-YI;NAKAO KENZO;HSIAO SHIH-WEI |
分类号 |
H01R13/00 |
主分类号 |
H01R13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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