| 摘要 |
This process is a fused glass powder process for making ceramic billets for semiconductor dopants. The powder process uses a unique combination of steps for packing, compacting and heat treating the powders. The resulting billets may be tailored in composition to provide a variety of densities, rigidities and B2O3 evolution rates. Further, the resulting wafers have a large diameter to meet the needs of semiconductor production.
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