| 摘要 |
PURPOSE: A manufacturing method of a metal board in which a conductive film of a multilayer is formed is provided to prevent the malfunction of a product due to heat by irradiating heat of a power element through a substrate member. CONSTITUTION: An insulating layer is formed in one side or both sides of a substrate member(S401). A buffer layer is formed on an insulating layer by vacuum evaporation of the conductive material(S402). A first conductive film is formed on the vacuum evaporation on the buffer layer(S403). A second conductive film is formed on the first conductive film(S404). A third conductive film is formed on the second conductive film(S405).
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