| 摘要 |
A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member. |
