| 摘要 |
PROBLEM TO BE SOLVED: To provide excellent flame retardancy and heat resistance as well as low dielectric loss tangent. SOLUTION: An epoxy resin composition contains an epoxy resin (A) and a curing agent (B) as essential constituents. The epoxy resin (A) has a molecular structure which has an polyaryleneoxy structure as a main skeleton thereof and in which glycidyloxy or methyl glycidyloxy group and a structural part (α) are bonded with an aromatic nucleus of the structure. The structural part (α) is expressed by structural formula (1) [in structural formula (1), each of R<SB>1</SB>and R<SB>2</SB>independently expresses methyl group or hydrogen atom, Ar expresses phenylene group, phenylene group nuclear-replaced by one to three 1C-4C alkyl groups, naphthylene group or naphthylene group nuclear-replaced by one to three 1C-4C alkyl groups and (n) is an integer of 1 or 2], wherein the abundance ratio of the aromatic nucleus constituting the structural part (α) is 0.1-0.5 mol per 1 mol aromatic nucleus constituting the polyaryleneoxy structure in the molecular structure and the softening point of the epoxy resin (A) is 80-140°C. COPYRIGHT: (C)2011,JPO&INPIT |
