发明名称 CASE MOLDED CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case molded capacitor used on a vehicle or the like, which is excellent in heat dissipation characteristics and heat resistance by solving the problem of low heat resistance. SOLUTION: In the case molded capacitor constituted by connecting a plurality of capacitive elements by a bus bar provided at one end thereof with a terminal, housing them in a case, and carrying out resin molding except the terminal of the bus bar, the plurality of capacitive elements are arranged in parallel, and a capacitive element arranged at a part closest to the terminal provided to the bus bar is made superior in withstanding voltage to other capacitive elements, thereby providing the case molded capacitor which exhibits stable performance and has excellent life-time characteristics, and is highly reliable. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011101042(A) 申请公布日期 2011.05.19
申请号 JP20110009627 申请日期 2011.01.20
申请人 PANASONIC CORP 发明人 NAKATSUBO KAZUHIRO;OKUNO SHIGEO;NAGATA YOSHIYA
分类号 H01G4/228;H01G4/015;H01G4/18;H01G4/224 主分类号 H01G4/228
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