| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film transfer device and a thin-film transfer method, which can excellently transfer a thin film, formed on a surface of a thin-film carrier, to a substrate while preventing a second plate from coming into contact with the thin-film carrier, when the thin film is transferred to the substrate by being pressed against the substrate while a reverse surface of the thin-film carrier is supported by the second plate. SOLUTION: An upper surface 37 of the second plate 19, which supports a reverse surface of a sheet film F, has an uneven shape, and satisfies 2μm≤Rz≤11μm and RSm≤25μm, wherein Rz is a maximum height defined by JIS B 0601-2001 and RSm is a mean length of a roughness curve element. COPYRIGHT: (C)2011,JPO&INPIT |
