Method for positioning stamp relative to mold of punching device by using bag manufacturing unit, involves using positioning pin for positioning in positioning hole of stamp

摘要

The method involves using a positioning pin (4a,4b) for positioning in a positioning hole (9a,9b) of a stamp (2). The positioning pin is positioned in another positioning hole (8a,8b) of a mold (1). The positioning pins are positioned together in a punching initial position before punching with the stamp and the mold. An independent claim is also included for a bag manufacturing unit.