HEAT DISSIPATION STRUCTURE OF HEATING PARTS, CIRCUIT DEVICE WITH THIS HEAT DISSIPATION STRUCTURE, AND METHOD OF MANUFACTURING HEAT DISSIPATION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a circuit device capable of efficiently conducting heat generated by a switching element to a heat sink, which requires an electrical insulation between the switching element and the heat sink in addition to heat conduction between the switching element and the heat sink in order to diffuse the heat generated by the switching element from the heat sink. SOLUTION: The circuit device includes a switching element S1 which generates heat by carrying a current, a heat sink 10 for diffusing heat generated by this switching element S1, and an insulating member 30 for electrically insulating both. The insulating member 30 consists of filler which is filled and cured between the switching element S1 and the heat sink 10 while having liquidity. COPYRIGHT: (C)2011,JPO&INPIT