发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
A method for manufacturing an integrated circuit package system includes: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.
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申请公布号 |
US2011115098(A1) |
申请公布日期 |
2011.05.19 |
申请号 |
US201113017170 |
申请日期 |
2011.01.31 |
申请人 |
SONG SUNGMIN;AHN SEUNGYUN;BAE JOHYUN |
发明人 |
SONG SUNGMIN;AHN SEUNGYUN;BAE JOHYUN |
分类号 |
H01L25/11;H01L21/56;H01L21/98;H01L23/48 |
主分类号 |
H01L25/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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