SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME

摘要

Disclosed is a slurry for chemical mechanical polishing, which contains (a) a water-soluble clathrate compound, (b) a polymer compound that comprises, as a side chain, an acidic group which may be in the form of a salt, (c) abrasive grains and (d) water. The slurry for chemical mechanical polishing is characterized in that: the content of the water-soluble clathrate compound (a) is 0.001-3% by mass (inclusive) of the total mass of the slurry; the polymer compound (b) has a weight average molecular weight of 1,000 or more but less than 1,000,000; and the content of the polymer compound (b) is 0.12-3% by mass (inclusive) of the total mass of the slurry. Also disclosed is a polishing method for a substrate, which uses the slurry for chemical mechanical polishing.