HEAT RELEASE STRUCTURE, A METHOD FOR MANUFACTURING THE SAME AND LIGHT EMITTING DEVICE HAVING THE SAME

摘要

PURPOSE: A heat radiation structure, a manufacturing method thereof, and a light emitting device package are provided to transmit heat from the upper side to the lower side of the substrate through a penetration hole by filling electroless plating in the penetration hole using laser. CONSTITUTION: A heat radiation structure(10) is formed by processing a metal organic compound. A cooling plate(20) cools heat transmitted from the upper side of the heat radiation structure. A light emitting device chip(30) is mounted on the upper surface of the heat radiation structure. An electrode pattern(50) is formed on the upper side of the heat radiation structure by electroless plating. The electrode pattern is electrically connected to the light emitting device chip by an electric wire(40).