| 摘要 |
A method of forming a MEMS microphone, the method comprising:
providing an SOI wafer having a top layer;
forming a sacrificial material on the top layer of the SOI wafer;
forming a diaphragm on the sacrificial material;
forming a hole through the diaphragm;
forming a channel through the sacrificial material, the hole and channel being in fluid communication, the channel exposing a bottom surface of the diaphragm and a top surface of the top layer of the SOI wafer;
adding wet etch resistant material having a first portion within the channel and a second contiguous potion that is external to channel and substantially completely fills the hole through the diaphragm; and
removing at least a portion of the sacrificial material before removing any of the wet etch resistant material. |
